Record #19520
Localization of Short and Open Defects in Multilayer Through Silicon Vias (TSV) Daisy-Chain Structures
Original paper date
Apr 6, 2017
Original DOI
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Open access
No
Article type
Broad categories
Notes from Retraction Watch
see also: https://www.ieee.org/about/news/2018/retractions-from-ieee-transactions-on-electromagnetic-compatibility.html;
Citation lifecycle
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Pre-retraction
0
Same day
0
Post-retraction
6
% post-retraction
100.0%
~0.0 citations/yr before retraction · ~0.7 citations/yr after
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