Record #45440
In-situ study the effect of IMC thickness on tensile behavior of the Cu/Sn0.7Cu/Ni interconnects
Original paper date
Aug 12, 2019
Original DOI
Citation lifecycle
How this paper is being cited
Pre-retraction
0
Same day
0
Post-retraction
0
% post-retraction
0.0%
~0.0 citations/yr before retraction · ~0.0 citations/yr after
— citing papers
Who is still citing this work
Loading…