Xxera/openscience/retractions

Record #67976

Estimation of Thermomechanical Fatigue Lifetime of Ball Grid Solder Joints in Electronic Devices Using a Machine Learning Approach

Tzu-Chia Chen, Maria Jade Catalan Opulencia, Hasan Sh Majdi, Ali Thaeer Hammid, Himanshu Sharma, Sami Sajjadifar, Aravindhan Surendar

Journal

Journal of Electronic Materials

Publisher

Springer - Nature Publishing Group

Original paper date

Apr 26, 2022

Original DOI

10.1007/s11664-022-09635-2

Country

🇮🇳 India · 🇮🇷 Iran · 🇮🇶 Iraq · 🇹🇼 Taiwan · 🇦🇪 United Arab Emirates

Institution

Department of Industrial Engineering and Management, Ming Chi University of Technology, New Taipei City, 24301, Taiwan · College of Business Administration, Ajman University, Ajman, United Arab Emirates · Al-Mustaqbal University College, Hilla, Iraq · Computer Engineering Techniques Department, Faculty of Information Technology, Imam Ja’afar Al-Sadiq University, Baghdad, Iraq · Department of Computer Engineering and Applications, GLA University, Mathura, India · Department of Chemistry, Payame Noor University, PO BOX 19395-4697, Tehran, Iran · Saveetha Institute of Medical and Technical Sciences, Chennai, India

Open access

No

Article type

Research Article

Broad categories

(B/T) Data Science (PHY) Engineering - Structural (PHY) Materials Science

Citation lifecycle

How this paper is being cited

Pre-retraction

11

Same day

0

Post-retraction

0

% post-retraction

0.0%

~3.7 citations/yr before retraction · ~0.0 citations/yr after

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