Record #71052
Low temperature soldering technology based on superhydrophobic copper microlayer
Journal
Publisher
Original paper date
Mar 23, 2024
Original DOI
Country
Institution
School of Mechanical and Electrical Engineering, Guangzhou Huali College, Guangzhou, 511300, PR China · School of Advanced Manufacturing, Guangdong Songshan Polytechnic College, Shaoguan, 512126, PR China · School of Intelligent Equipment Manufacturing, Zhongshan Torch Polytechnic, Zhongshan, 528436, PR China
Open access
No
Article type
Broad categories
Citation lifecycle
How this paper is being cited
Pre-retraction
1
Same day
0
Post-retraction
0
% post-retraction
0.0%
~0.6 citations/yr before retraction · ~0.0 citations/yr after
— citing papers
Who is still citing this work
Loading…